超声表面波技术表征ULSI互连薄膜特性与数值算法的分析.pdfVIP

ABSTRACT With the development of semiconductor technology, the feature size of integrated circuit (IC) is decreasing. In deep submicron IC design, the interconnection delay and crosstalk become the important factor that impacts the performance of IC. The interconnection of Cu/low-k is employed to replace the Al/SiO2 interconnection, which relieves the problem of interconnection delay and crosstalk. The mechanical character of low-k influence the application in interconne