JESD22-A111_2004通过全身焊料浸入小型表面贴装固态器件确定底部侧板连接能力的评估程序.pdfVIP

JEDEC STANDARD Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices JESD22A111 MAY 2004 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve th