sop封装工艺流程介绍.ppt

SOP ASSEMBLY PROCESS FLOW QUALITY CONTROL INSTRUCTION Contents Package Instruction Process Flow Quality Control Package Instruction SOP SSOP 3. TSSOP 4. MFP Package Instruction ASY process flow Wafer Saw Die Attach Wire Bond Wafer Mount Wafer Grinding Epoxy Cure Molding Post Mold Cure Plating Trim/Form Packing Shipping De-junk Laser Marking 前段制程 后段制程 Wafer Die (chip) Die on Lead frame Before After Laser Marking Laser Marking Wafer Grinding LOAD UNLOAD GRINGING Purpose: Grinding the wafer to Customer required thickness Wafer Grinding 研磨機 晶元背面Wafer backside Frame Mount Tape Purpose: Combine the wafer with Dicing tape onto the frame for die sawing Wafer mount Machine Wafer Mount Frame Purpose: To separate dies from each other for die attach Monitor Load/Unload Sawing Cleaning Machine Wafer Saw Before wafer saw: After wafer saw: Wafer Saw Purpose: Attach the dies with epoxy on substrate for the following process Die Attach Output Die bond Substrate load bond Working flow: Die Attach Robber tip Lead-frame Purpose: Solidify the epoxy after D/A Inside Oven Epoxy Cure Purpose: Connecting the chip and the exterior circuit input Theory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag…) Wire Bond Mold Machine Molding Purpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic. Molding Molding Top chase Air vent Bottom chase Cavity Leadframe Plunger Pot Gate insert Runner Compound Bottom cull block Top cull block Molding Molding Top chase Air vent Bottom chase Cavity Leadframe Pot Gate insert Runner Compound Bottom cull block Top cull block Plunger Molding Molding Top chase Air vent Bottom chase Cavity Leadframe Pot Gate insert Runner Compound Bottom cull block Top cull block Plunger Molding After Mold Molding Top chase Air vent Bottom chase Cavity Leadframe Pot Gate insert Runner Compound Bottom cull block Top cull block Plunger