IC封装产品及制程简介.pptVIP

;产 业 概 说 ;Contents ;;Why need to do IC packaging;What’s “ IC Package “;;;IC Package Family ;Something about IC Package Category ;IC Package application ;Category of IC Package ;Category of IC Package--example 1;;Copper Lead frame;封裝原物料 ── 金線 與 Compound;Ball Bond : Shape / Position;After KOH etching view;封裝原物料 ── Lead Frame 與 打線的關係;;Process Flow Chart, Equipment Material;;Conventional IC Packaging Process Flow;;TSOP Process Flow Control;TSOP Process Flow Control -Cont. ;TSOP Process Flow Control -Cont. ;Our Reliability Test System;TCP COF