PE613010安装底部端接元件的焊接准则.pdfVIP

Soldering Guidelines for Mounting Bottom-terminated Components Application Note 62 Objective The objective of this application note is to provide Peregrine Semiconductor customers with general guidelines for soldering and assembly of quad flat pack–no leads (QFNs) and other bottom-terminated components (BTCs). Precise process development and designed experi- mentation are needed to optimize specific application/performance. Introduction QFNs are thermally enhanced plastic leadless packages with electrical connections made via lands on the bottom side of the component to the surface of the connecting substrate (PCB, ceramic, LTCC, etc.). Reflow soldering of surface mount assemblies provides mechanical, thermal and electrical connections between the component leads or terminations and the substrate surface mount land pattern. Solder paste may be applied to the surface mount lands by various methods, such as screen printing and stencil printing. Peregrine Semicon- ductor packages are categorized as surface mount components (SMCs). Unlike through-hole components, SMCs rely entirely upon the solder interface for mechanical strength. The solder joint properties, design and reflow process are of critical importance for successful assembly. Figure 1 shows the top side and bottom side of the QFN package. Figure 1 • QFN Top Side and Bottom Side Top Side Bottom Side ©2016, Peregrine Semiconductor Corporation. All rights reserved. • Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Application Note