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台積六廠節能措施簡介
台積六廠節能措施簡介
■六廠介紹
■節約能源措施
■建廠設計階段…4-22
■生產運轉階段
23~29
■90年度節能計劃.30-31
■參觀路線圖
32
六廠介紹
性理
Total clean Room spac
17648m2
:0.2500.180.150.13mm
≌60,000 month(8
Fab-6 Profile
Fab-6 is the first of the six fabs TsMc plans to establish in the Tainan
Science Industrial Park(TSIP). Fab-6 broke ground in July 1997 and
started production in January 2000
8-inch wafer and 4.500 pcs of 12-inch wafer per month
Technology
tsba-lowhe -aren can istaaturing capablities bat t lsacicider
mechanical polishing, low-k dielectrics, and copper
Product Mix
igital logic products. mixed-signal logic products, standard and
embedded memory products
Clean Room
Mini-environment
Key Milestones
07/97 Fab-6 Ground-Breaking Ceremon
T The first fab in Tainan Science-based Industrial Park
T More than three thousands of RC piles were drilled into ground 25 meter deep to
02/98 Erection of steel Structure
10/99 Process Tools move in
T The most advanced 0.25-0.10 micron semiconductor technology
12/99 Successful Pilot of 0.25 and 0.22 um Products
01/00 Production Start
06/00 Achleved the FIrst 10K Wafers output
07/00 Release 0. 1 8um to Full production
12/00 Achieved 30K Wafers Output
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