微纳电子材料和工艺.pptVIP

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  • 约小于1千字
  • 约 90页
  • 2020-09-02 发布于福建
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chip. We find O Packaging material-cither some polmer blend or caramics O like P.B. As.SiO, SiaN4. MoSin. W. IIN.A cha. intricate pattern with other materials A chipmostly consisting of si, but interlaced in an of the package made of so O Tmy wires connecting the leads to the chip or some pretty sophisticated stuff doing this job kADa四y叫a: Liquid crystals, some strange lqud stuff. ● Amorphous Si. tin oride iro. O Plastic fois acting as polarizers OA plastic(or giass) front and end plate Now lets look at the laser coming with the cd drive o You find a complex mix of GaAs GaAlAs. s

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