fab中常见缩写介绍.doc

硬件相关： ESC: Electrical Static Chuck 静电卡盘 TMP: Turbo Molecule Pump 分子泵 DP: Dry Pump 干泵 EPD: Endpoint Detection 终点检测系统 OES: Optical Emission Spectrograph 光学发射光谱仪 IEP: Interferometer Endpoint Detection 干涉测量仪 软件相关： CTC: Cluster Tool Controller 群集设备控制器 PMC: Process Module Controller 工艺模块控制器 TMC: Transfer Module Controller 传送模块控制器 工艺相关： BT: Break Through 去除自然氧化层 ME: Main Etch 主刻 OE: Over Etch 过刻 STI: Shallow Trench Isolation 浅沟槽隔离刻蚀 PR: Photo Resist 光刻胶 CD: Critical Dimension 关键尺寸 AEI: After Etch Inspection ADI: After Developed Inspection ROX: Remaining Oxide 剩余Oxide层厚度 ER: Etch Rate 刻蚀速率 EU: Etch Uniformity 刻蚀均匀性 AEC/APC: Advanced Equipment/Process Control 先进设备/工艺控制 PRK: Particle Reduce Kits 减少颗粒过程 PM: Periodic Maintenance 周期维护 芯片加工商相关： CoO: Cost of Ownership CoC: Cost of Consumption PRS: Process Release Standard STR: Split testing release MSTR: Mass Split Testing Release WAT: Wafer Acceptance Test Fab: Fabrication 芯片加工厂代称 FA: Fab Automation 工厂自动化 CIM: Computer Integration Manufacturing 计算机集成制造 通用术语 Table 1 Acronyms Table 表1 缩写列表 Acronyms/缩写 Explanation/解释 1 WAT Wafer Acceptance Test /晶圆测试 2 RF Radio Frequency /射频 3 CD Critical Dimension /关键尺寸 4 Cp Yield Yield /良率 5 PR Photo resist /光刻胶 6 STI Shallow trench isolation /沟槽隔离（刻蚀工艺） 7 MFC Mass Flow Controller /质量流量计 8 ADI After develop inspection /显影后检查 9 AEI After etch inspection/刻蚀后检查 10 CoO Cost of Ownership /客户拥有成本 11 CoC Cost of Consumables /消耗成本 12 MTBF Mean Time Between Failure /平均故障间隔时间 13 MTTR Mean Time To Repair /机台平均维修时间 14 MTBC Mean Time Between Clean /平均清洗间隔时间 15 FECP Field Equipment Change Procedure /设备合格认证流程 16 CE Customer Engineer /客户硬件支持工程师 17 PSE Process Support Engineer /客户工艺支持工程师 18 HCI Hot Carrier Inject /热载流子注入测试 19 EFR Early Failure Rate /早期失效率测试 20 HTOL Hot Temperature Operation Life 168/500/1000 Hour test/ 168/500/1000小时高温运行寿命测试 21 WPH Wafer Per Hour /每小时加工的硅片数量 TJ SMIC 术语 Table =