Presentation 74 - 25Gbps及以上背板无源信道特性的测量与3D EM仿真之间的相关性.pdfVIP

Correlation between measurement and 3D EM simulation for 25Gbps and beyond backplane passive channel characterization Lei Yue Application Engineer Keysight EEsof EDA • Evaluation Overview – Simulate a stripline differential pair located at the 11th layer on 24-layer high speed backplane board up to 50GHz, and correlate the simulation result of the insertion loss with measurement. • Objective – Explore a practical method and tool to quickly and accurately get the simulation results good matched with measured. 2 Challenges Used slot for non-signal trace planes and ➢ How to ensure the accuracy of PCB characterization and lumped model for ground vias model extraction up to 50GHz ➢ How to get the accurate results as quickly as possible ➢ Traditional EM solver Momentum and FEM are not fit for this kind of 24-layer PCB board up to 50GHz Simulation by 3D planar EM solver aborted manually at the first frequency point 3 PCB Layout and Stack-up • Ensure the correct simulation input Layout Stack-up with Backdrill 3D View Controlled Line Impedance Analysis Material Definition