文稿课件参考开箱报告ip-substrate , air damper broke 03-02-2017.pptxVIP

Problem type: Packaging problemProblem description:HCP found Air damper of IP substrate assy-HIG broke, and fixing area at IP-Substrate also broke, so need reject IP-Substrate. We can’t use and repair this part.Potential root cause: Packaging not suitable Model: AS 21 Concerned Part name : IP substrate assy-HIGConcerned Part no.:ssue date: 03 Feb 17Issue place : HCPNG Q’ ty: 2 pcsPhase: SOPRe-Occurrence: YICA: See previous last pagePrepared by Wasana W.Problem description:HCP found Air damper of IP substrate assy-HIG broke, and fixing area at IP-Substrate also broke, so need re