asm焊线机参数指导.pptVIP

ASM CMLT Ball Size Gold Remain Issue- Smaller capillary CDATS WB Process 第一页，共8页。 Die source : Chi-Mei 14 x 17mil chip Pad Opening : P Pad 94um, N Pad 92um Bonding Method : BSOB 2 wires Device : 3020 18 columns x 8 rows Ball shear spec : 42g Ball size spec : Max 85um Gold remain spec : 50% Gold Wire : KS AW99 1mil (EL 2-7% BL 9g) Capillary : GAISER 1551-13-437GM 65(6x120D-8D-10) (CD:2.5mil (63.5um) Tip:6.5mil Hole:1.3mil) Material Background Spec P Pad N Pad 第二页，共8页。 Machine type : Harrier S/N TE019-052 Software ve