Hsio technologies grypper 系列测试插座.pdf

S P E C I F I C AT I O N S H E E T Grypper High performance, 0.65 mm pitch net zero package footprint engineering test sockets for BGA style packaged devices HSIO Technologies Grypper series test socket is the next best thing to not having a socket at all. With superior electrical performance, the Grypper series test sockets allow BGA devices to fit into the exact end-use location for sample boards, failure analysis and other applications, where the space is limited only to IC packages itself. The BGA IC package simply snaps into the Grypper sockets. The Grypper sockets with their dual beam contact are designed for BGA IC packages with 0.65 mm pitch to 1.0 mm pitch. The Grypper is ideal for various applications, such as failure analysis, system-level test, device development and characterization. The Grypper is widely used in the characterization of DDR2, 3, and 4 type memory devices and other memories. FEATURES AND BENEFITS Package-size PCB footprint Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall test costs No lid required The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the backside of the device Excellent signal performance A short signal path achieves low inductance and low insertion loss,