JSTDD中英文对照版.pdfVIP

J-STD-020D  J-STD-020D  Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices / / 非密封固态表面贴装元件湿度 回流焊敏感度分级  非密封固态表面贴装元件湿度 回流焊敏感度分级  1 PURPOSE( 目的）  1 PURPOSE( 目的）  The purpose of this st nd rd is to identify the cl ssific tion level of nonhermetic solid st te surf ce mount devices (SMDs) th t re sensitive to The purpose of this st nd rd is to identify the cl ssific tion level of nonhermetic solid st te surf ce mount devices (SMDs) th t re sensitive to moisture-induced stress so th t they c n be properly p ck ged, stored, nd h ndled to void d m ge during ssembly solder reflow tt chment nd/or moisture-induced stress so th t they c n be properly p ck ged, stored, nd h ndled to void d m ge during ssembly solder reflow tt chment nd/or rep ir oper tions. rep ir oper tions.    . 本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装，储存，作业以避免在回流和维修作业中被损伤. 本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装，储存，作业以避免在回流和维修作业中被损伤 This st nd rd m y be used to determine wh t cl ssific tion/preconditioning level should be used for SMD p ck ge qu lific tion. P ssing the criteri in This st nd rd m y be used to determine wh t cl ssific tion/preconditioning level should be used for SMD p ck ge qu lific tion. P ssing the criteri in this test method is not sufficient by itself to provide ssur nce of long-term reli bility this test method is not sufficient by itself to provide ssur nce of long-term reli bility