UL制程参数分析和总结.pdf

流程 PROCESS A 多层板 1. May cut boards. 2. May image for innerlayer; laminate dry film at 110°C maximum for 1 minute maximum. 3. May etch using any etchant except chromic/sulfuric. 4. May strip etch resist, rinse and dry. 5. May apply black oxide treatment. 6. May dry at 150°C maximum for 120 minutes maximum. 7. May laminate boards at 220°C maximum for 30 minutes maximum at lamination pressure of 350 PSI maximum. 8. May cut, drill and debur boards. 9. May apply electroless copper plate. 10 May scrub boards. . 11 May print pattern by silk screening or laminate dry-film at 110°C maximum for 1 minute maximum. . 12 May electroplate copper, then electroplate tin-lead. . 13 May strip plating resist. . 14 May etch using any etchant except chromic/sulfuric. . 15 May strip tin-lead. . 16 Nonflame and HB rated types may be coated with any solder resists. Vrated types may be coated with the resists indicated in the following pages. . Boards may then be dried at 150 C maximum for 60 minutes maximum. 17 May apply marking ink, and cure at 150°C maximum for 40 minutes maximum. . 18 May solder reflow using hot air solder level at 265°C maximum for 4 seconds maximum. . 19 May electroplate nickel and then gold on contact fingers or entire pattern. . 20 May perform punching or routing. . 21 May wash and dry boards. . 22 May apply flux. . 23 No other plating operations performed and no other temperatures over 100°C (212°F), operating temperature, encountered. . 单面板 1. Cut, clean and dry laminate. May preheat laminate at 80C max. for 15 minutes max. 2. May electroplate nickel, tin or gold. 3. Print circuit pattern and dry at 78C max. for 25 minutes max. 4. Etch in any etchant except chromic-sulfuric. 5. Remove etching resist and dry at 40C max. for 80 minutes max. 6. Non-flame and 94HB rated boards may use any resist. 94V rated boards may