tsmc memsks s200 2sp规格自动喷涂系统配置及台积电用文件.pdfVIP

System Configuration Specification: KS-S200-2SP Automatic SprayCoating SystemConfiguration Specification 1. Process Wafer: Substrate: ø200mm,wafer Material: Silicon, Glass 2. Coating Chamber: 2 Chambers (Followingdescriptionfor 1Chamber) 2.1 Centrifuge Speed Max. Speed: 300rpm Min.Adjust: 1rpm SpeedAccuracy: ±1rpm (when 50rpm~300 rpm) 2.2 CHUCK Hot te Chucking Method ： Vacuum Suction Chuck Vacuum Sensor: Digita