双金属板热应力分析：锗与焊料组合稳态热与应力模拟.pptx

WS16-1WORKSHOP16THERMALSTRESSANALYSISOFABI-METALICPLATEThermalStressFromThermalNAS104,Workshop16,March2004Copyright?2004MSC.SoftwareCorporation

ProblemDescription Forthisexampleperformathermalstressanalysisofabi-metallicstripmadeofGeandsolder.Thedimensions(lengthxwidth)ofthebi-metallicstripareoneinchbyoneinch.Thethicknessforthesoldermaterialis0.05inch,andthethicknessoftheGematerialis0.025inch.Thustheassemblythicknessis0.075inch.Theoutside(awayfromthesolder/Geinterface)surfacetemperatureofthesolderis70