wirebonding详细学习资料教育课件.pptVIP

wirebonding详细学习资料PPT讲座

CONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT

封裝簡介晶片Die金線GoldWire導線架Leadfram

WaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKG

WireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)

GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.