Panasonic Industry Co., Ltd. 半导体封装材料 CV5300 series 技术手册.pdf

Panasonic Industry Co., Ltd. 半导体封装材料 CV5300 series 技术手册.pdf

Highfluidity

Excellentfillabilityfor

narrowgap/pitchCV5300series

Reducedvoid/bleed

Capillaryunderfill(CUF)

semiconductorencapsulationmaterials

Applications

ICPackage/Mobile

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