Microsoft内部关于WinCE培训资料2005-05-11_Module 1 Int

Module 1: Introduction to Windows CE Overivew Windows CE Design Goals Windows CE Architecture Supported Technologies, Libraries, and Tools System Memory Architecture Windows CE Design Goals Small Protable Modular and Compact Win32 Compatible Development Tool Support Connectivity Real-time Small Typical hardware: 4MB-8MB ROM Samllest footprint: 500K Win32 API is only API Win32 API is subset of desktop Compared to Windows Me(100MB) or Windows 2000(500MB) Portable Easy portability to new processors Most parts of the OS written in C Various processors supported Easy portability to new platforms OAL layer Modular and Compact Modules Kernel, GWES, Filesys, and Communications Each module is divided into components Build an OS image that fits your needs Windows CE configurations: MINKERN, MININPUT, MINCOMM, MAXALL, IESAMPLE. . . Components can be added, deleted, or replaced Execute In Place (XIP) from ROM Win32 Compatible Uses the same Win32 programming model Supports a large number of Win32 API functions Supports other programming interfaces: MFC, ATL and Embedded VB Advantages: Ease of porting existing Windows applications Many developers have good Windows knowledge Development Tool Support Not restricted to a particular language Strong development support Embedded Visual Basic/C++ Tools: Remote debugger, emulators Tech: COM, DCOM and MSMQ APIs: TAPI, Winsock. . . Lib: ATL, MFC Connectivity Win CE devices designed for mobility Support connectivity to desktop PC, other Win CE devices, and the Internet Wide variety of comm options and API: serial, LAN, modem, infrared. . . Secure comm at all levels Synchronization model: ActiveSync Real-time Interrupt Handling Guaranteed maximum latency for highest priority interrupt Nestable (Prioritized) interrupt handling Thread Scheduling Guaranteed maximum latency for highest priority thread 256 thread priorities Controllable thread quantum Windows CE Architecture Overview of Windows CE Architecture The Hardware The OEM Adaptation