CMP 終点検出モニタ用渦電流式センサとその応用.pdfVIP

CMP 三　谷　隆一郎＊ Eddy Current Sensor for Endpoint Monitoring of a Chemical-Mechanical Polishing System by Ryuichiro MITANI Eddy current sensor have been developed for precise monitoring of wafer polishing endpoints in CMP systems. The sensor enhances the preciseness of endpoint detection, greatly improves the planarity of metal films, and thus satisies demands in the ever-progressing semiconductor device market. Keywords: Eddy current, Rr