焊头机构运动建模与仿真技术的研究.pdfVIP

第38 卷 第2 期 电 子 科 技 大 学 学 报 Vol.38 No.2 2009年3月 Journal of University of Electronic Science and Technology of China Mar. 2009 ·机械电子工程 · 焊头机构运动建模与仿真技术的研究 袁清珂，刘大慧，曾德东，颜旭晖 (广东工业大学机电工程学院 广州 510006) 【摘要】为了开发高速高精度焊头机构，确保全自动LED键合机的整机性能，在完成运动方案和结构参数设计后，研究 了运用Pro/Engineer运动仿真模块Mechanism/Pro对整个焊头机构进行运动建模的技术与方法，包括机构模型创建、驱动控制等， 进行了机构运动仿真；并对仿真结果进行了分析，验证了所设计的焊头机构的可行性和合理性。成功地将设计出的焊头机构 应用到整机设备开发，满足了整机功能和性能的要求。该设备已投入实际生产运行。 关 键 词 键合机; 产品开发; 焊头机构; 运动学; 半导体设备制造; 虚拟样机 中图分类号 TP391.9; TH122; TH134 文献标识码 A doi: 10.3969/j. issn. 1001-0548. 2009. 02. 38 Motion Modeling and Simulation Technology of Bonding Head Mechanisms YUAN Qing-ke , LIU Da-hui, ZENG De-dong, and YAN Xu-hui (College of Mechanical Electrical Engineering, Guangdong University of Technology Guangzhou 510006) Abstract In order to develop a bonding head mechanism with high-speed and high-precision characteristics and ensure the whole machine performance of automatic LED die bonders. A motion proposal and structure parameters of the head mechanism are designed, the motion modeling technologies and methods of the whole head mechanism are researched by using the Mechanism/Pro module of Pro/Engineer software, including mechanism modeling, driving control, and so on. The motion simulation of the whole head mechanism is executed, the simulation results are analyzed and show the feasibility and rationality of developed head mechanism, The head mechanism has been successfully used to the LED die bonding machine with desired functions and performances. Key words die bonder; dynamics product development; head mechanism; kinematics; semiconductor device manufacture; virtual prototyping 高