半导体硅片加工过程复合控制策略的研究及仿真.pdfVIP

系 统 仿 真 学 报 Vol. 17 No. 8 1924 JOURNAL OF SYSTEM SIMULATION Aug. 2005 半导体硅片加工过程复合控制策略研究及仿真 王遵彤, 乔 非, 吴启迪 同济大学CIMS 研究中心, 上海 200092 摘 要 复合优先级控制策略CPC 是一种兼顾投料与调度策略的生产过程综合控制策略 通过比 较加工任务的复合优先级系数 CPC 策略能够确定下一个加工任务 以及决定何时投放新工件 CPC 策略甚至能够暂停非瓶颈设备以避免瓶颈设备前的在制品堆积 仿真结果表明 这种复合控 制策略是一种能够同时优化多种性能指标的生产过程控制策略 可降低加工周期及其方差 减少生 产过程中的在制品数 提高设备利用率及生产率等 关键词 半导体 硅片加工 控制策略 调度策略 投料策略 仿真 文章编号 1004-731X (2005) 08-1924-04 中图分类号 TP278 A 文献标识码 A Research and Simulation of Compound Controlling Strategy in Semiconductor Wafer Fabrication WANG Zun-tong, QIAO Fei, WU Qi-di (CIMS Research Center, Tongji University, Shanghai 200092, China) Abstract: A new compound priority control strategy, CPC, is discussed, which integrates the scheduling and lot release policies into a whole. The compound priority measure is composed by seven sub-priority items. By comparing the compound priorities of jobs that compete with for processing, the CPC strategy can determine which lot(s) is/are processed when the machine is available, and when the new lot(s) is/are released into the wafer fab. The CPC can halt the non-bottleneck machines to prevent overstock of WIP before the bottleneck machines. The simulation results indicate that the CPC strategy has higher performance in reducing the cycle time and its standard deviation, decreasing the WIP inventory, and increasing utilization of machines and fab’s throughput rate. Key words: semiconductor; wafer fabricati