FPC-QC工程图(英文版)1.xlsVIP

Sheet1 浸锡试验Immersion Tin test 浸锡Immersion Tin 40PNL/1PNL 40PNL/5PNL 拒收、返工Rejection ,Rework 热电偶Thermocouple QC 不甩油Not shedding 加强控制Strengthen control 温湿度记录表Temperature and humidity records Table 烘板温度Baking temperature 每Lot/5PNL 5PNL per lot 拒收、返工Rejection ,Rework 胶纸测试Adhesive tape test 3M胶纸 3M Brand tape 每Lot/2PNL 2PNL per lot 胶纸测试记录表Adhesive tape test records table 钻孔Drilling 字符 Symbol Marking 钻头来料检查Drill bit incoming inspection IQC来料检查记录表IQC Incoming inspection records table 《钻头检验作业指导书》Drill bit inspection operating instructions 钻头使用次数Drill bit frequency of use 钻头检验记录表Drill bit Inspection records Table 温度计Thermometer 游标卡尺Vernier caliper 40X放大镜 40X magnifier 1、流酸H2SO4SPS（1-3%） 2、115736碱性溶液115736alkalescence solution 3、T0222 4、115737碱性溶液 15737alkalescence solution 5、微蚀溶液Solution for Micro-ethcing 参照XC-WI-GY-39 Refer to XC-WI-GY-39 返工Rework 调整Adjust 《电镀铜操作规范》Electro-Plating copper working instruction 6、Cu＜25g/L Au,Ni Thickness Au Min 0.5um,Ni 1-4um;No peeling ,No appearance. 表面处理Surface Treatment 化学分析报告Chemical analysis report 微蚀Micro-etching 每天一次Once/day 调整浓度参数Concentration parameter adjustment 氯化镍NiCL2 调整Adjust 电流密度Current density 温度Temperature 金缸Au container 金浓度 Au Consistence 调整浓度参数Concentration parameter adjustment 波比度SG（Beo） 时间Time 随机抽查 Random inspection 生产记录表Production Records 电流密度Current density 温度Temperature X-Ray机/ 目视或20倍镜 X-Ray M/C /Visual Or20X magnifier/3M Tape 首板检查记录FA Inspection recorder 调整Adjust 外观检查/附着力Appearance Inspection/Peel strength 目视或20倍镜Visual O r20X magnifier /3M Tape 8Panel/100Panel IPQC Inspection recorder 金镍厚度Ni/Au thickness Au Min 0.5um,Ni1-4um X-Ray机 X-Ray M/C One Panel/100 Panel 目视,放大镜 Visual, magnifier 针测Electrical test 测试Testing 电压 Voltage 导通值Conduction value 电脑显示Computer display 绝缘值Insulation value 开、短路Open-Short Circuit 每批第一张 The first panel per Lot 10张检1张 tested one every 10 panels 针测首板记录表Firest Articles Electrical test records table 拒收、修理Rejection ,Repair 首板检查First Article Inspection 成品