QFN封装技术简介.pptVIP

QFN封装技术简介 样品外观 名称解释 QFN-Quad Flat No-Lead 即四面扁平无引线封装。又称 MCC-Microchip carrier 即微芯片载体封装。 QFN也是CSP封装的一种类型。CSP-Chip scale package 即 芯片尺寸封装。一般定义为芯片面积占封装面积的80% 应用领域 Telecommunication products Cellular phones Wireless LAN Portable products Personal digital assistants Digital cameras Low to medium lead count packages Information appliances 结构特点 Low profile (1.0 0.2 L/F+0.7 Mold) Light weight Cost effective Small footprint Better electrical performance Better power dissipation   封装考核标准 Package Level MSL JEDEC level 3 30°C/60%, 192 hours for PPF lead frameJDEEC l