轧制与退火处理对粉末冶金CuInvar电子封装复合材料结构和性能的影响.pdfVIP

Trans. Nonferrous Met. Soc. China 25(2015) 1995−2002 Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy 1 2 2 3 1,3 Dan WU , Lei YANG , Chang-dong SHI , Yu-cheng WU , Wen-ming TANG 1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China; 2. 43 Institute, China Electronics Technology Group Corporation, Hefei 230088, China; 3. Key Laboratory of Functional Materials and Devices of Anhui Province, Heifei University of Technology, Hefei 230009, China Received 27 August 2014; accepted 18 December 2014 Abstract: The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 °C. Phases, microstructures and properties of the composites were then studied. After that, the amount of α-Fe(Ni,Co) in the composites is reduced, because α-Fe(Ni,Co) partly transfers into γ-Fe(Ni,Co) through the diffusion of the Ni atoms into α-Fe(Ni,Co) from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conduc