Comprehensive Modeling of StressStrain Behavior l Drop Impact Loading Condition.pdf

Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition 1* 2 1 1 1 1 1 F.X. Che , John H.L. Pang , W.H. Zhu , Wei Sun , Anthony Sun , C.K. Wang and H.B. Tan 1 United Test Assembly Center Ltd. (UTAC) 5 Serangoon North Ave 5, Singapore 554916 * Email: fx_che@, Tel: 65 Fax: 65 2 School of Mechanical and Aerospace Engineering, Nanyang Technological University 50 Nanyang Avenue, Singapore 639798 Email: mhlpang@.sg; Tel: 65 Fax: 65 Abstract drop reliability by considering different factors such as component locations on the board, input-G level, support Board level drop testing is an effective method to conditions, solder material, etc. characterize the solder joint reliability performance of Recently, more FEA simulations were carried out for drop miniature handheld products. In this study, some drop testing impact reliability study. The dynamic material