具有热物理性能钼铜复合材料的挤压铸造工艺制造.pdfVIP

The thermo-physical properties of high dense Mo/Cu composites fabricated by squeeze casting technology Guoqin Chen Gaohui Wu Dezi Zhu Qiang Zhang School of Materials Science and Engineering, Harbin Institute of Technology No.92 West Dazhi Street, Harbin 150001, China chenguoqin@, wugh@, zhudz@, Zhang_tsiang @ Abstract Mo/Cu composites. Therefore, the manufacture method of Mo/Cu composites must be improved [5-7]. For applicability in the field of semiconductor, it is In the present work, the Mo/Cu composites with the important that the thermal expansion coefficient of heat sink content fraction of 55%, 60% and 67% were fabricated by the materials approximates to those of semiconductor chip and patent squeeze casting technology, the densification of which peripheral material. In addition, high thermal conductivity and were higher than 99%, with their microstructures and thermo- densification also is required. Mo/Cu composites are desirable physical properties tested and analyzed. for thermal management applications because of its combination of low thermal expansi