《Laser De-paneling Pesentation》.pptxVIP

Laser De-paneling ProjectTeam 1Victor TrevinoDaniel FortaneyJianhua ZhengTan LeiPengfei LiuAbstractThis project was applied specifically to the cutting process of the PCBs arrays that the company cut.We found out that the CO2 Laser cutting machine is the most suitable for the cutting process of the company ALPS in order to minimize the bad parts per million and maximize profit.IntroductionALPS is a company that produces electronic devices, including switches, potentiometers, sensors, encoders and touchpads.The main purpose of the project was to work as a team in order to achieve an objective imposed by the company. Through the process of doing that, research and comparisons between the different technologies was made in order to get the project done.Problem statementThe current router cutting process that ALPS is using has many downfalls, for example:1) Slow cycle time.2) Tooling gets dull very fast.3) Dust contamination remains on product.4) Each array needs a custom pallet with vacuum nest.5) Cuts are not consistent (leaving protruding material). Information gathering ResearchBasically, we considered three types of laser for the project. Those are:YAG solid laser cutting machine: It is not usually used for cutting non-metallic materials.CO2 laser cutting machine: It can cut wood, acrylic, PP, Plexiglas, plastic, etc.Fiber laser cutting machine: The wave length of the fiber laser cutting machine is 1.06um, it is not easily absorbed by non-metallic materials.Voice of Customer The objective for the project is to explore laser cutting FR4 circuit board material. The laser cutting process evaluation will improve the current “Router cutting process” to separate individual circuit boards from an array panel. The laser process needs to be defined for maximum utilization of the equipment. Based on what the project sponsors explained to be the problem they were facing, and the samples showed by the company which were cut by a CO2 laser, as well as the extra features the sp