《Suggested PCB Land Pattern Designs》.pdf

APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern Skyworks plastic encapsulated leadless style packages are being dimensions for a variety of leaded and leadless packages. These offered on a number of products to reduce size and weight, and to drawings conform with the Surface Mount Design and Land improve application performance. These packages are gaining Pattern Standard (IPC-SM-782) as published by the Institute for acceptance in the industry and are often referred to by such Interconnecting and Packaging Electronic Circuits (IPC). names as Quad Flat No-Lead (QFN), Leadless Plastic Chip Carrier Table 1 lists the land pattern drawings in this document together (LPCC), Dual Flat No-Lead (DFN), et. al. All of them conform to JEDEC outline MO-220. with their respective Figure numbers. These drawings are for reference purposes only. Skyworks recommends contacting the As indicated in Figure 1, leadless packages use perimeter lands company doing the component mounting and soldering for more on the bottom of the package to provide contact with the PCB. information related to actual land patterns (additional dimensions, These packages also have an exposed paddle on the bottom to etc.). provide a stable ground for optimum electrical performance of