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《PCB DESIGN 线路板设计要点》.pdf
DAWN TECHNOLOGIES(HK) LIMITED
6.1.2011
PCB DESIGN
PARAMETERS
Contact: Sales Engineer Mr.Li
T:086-0755xt.8007(Shenzhen)
F:086-0755Shenzhen)
M:086
E:lothar.li@;lotharlee88@
W:
PCB DESIGN PARAMETERS 4
1. MATERIALS 4
COPPER FOILS 5
STANDARD STOCK MATERIALS AT PRINTCA 5
FR4 Double sided (Rigid laminate) 5
FR4 Multilayer (Thin laminate) 5
Polyimide laminate 6
Flexible laminates 6
COPPER FOILS 6
Glass-epoxy prepregs GFN 6
Glass-polyimide prepregs GIL 7
Glass-polyimide prepregs GIJ 7
2. TRACK WIDTH ISOLATION 7
Outer layers: 8
Inner layers: 8
PLATED THROUGH HOLES (PTH) 8
NON PLATED HOLES 8
3. ANNULAR RING 8
Specification for designed hole/pad ratio: 9
The production tolerance 9
Printca prod. tol. for 21 panels; price optimum 9
Printca prod. tol. for 18 panels 9
Calculation of pad sizes, examples; 9
Example 1: 10
Example 2: 10
Example 3: 10
Power- ground-planes 10
ASPECT RATIO 11
TENTING OF UNPLATED HOLES 11
4. FINISH 12
Electroless Nickel/Immersion Gold (99.9% Gold) 12
HAL (Eutectic 63% Tin - 37% Lead) 12
Reflowed Tin/lead 12
Nickel - Hard Gold 12
Nickel - Soft Gold 13
Organic Solderability Preservative (OSP) 13
Edge Connector Plating 13
Selective Plating 13
2
5. SOLDERMASK 14
Via Capping with Screened Resist 14
Peelable Soldermask 14
6. ROUTING 15
Bevelling of edge connectors 15
Scoring 15
Depth controlled routing 16
7. PANEL UTILISATION 16
Multilayer Usable Area Diagrams 17
8.
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