《Analysis of High-Speed Package Substrate without Plating Bars》.pdfVIP

Analysis of High-Speed Package Substrate without Plating Bars Young-Woo Kim, Jin-Woo Jung, Yu-Seon Kim, Yeong-Seog. Lim Division of Electronis and Computer Engineering, Chonnam University 300 Yongbong-dong, Buk-gu, Gwangju, 500-757, Korea E-mail : limys@chonnam.ac.kr, Phone : +82-62-530-1752, Fax : +82-62-530-1759 Gwang Kim, Byung-Hun Ahn