《Microstructure evolution of 7050 aluminum alloy during hot deformation》.pdf

Microstructure evolution of 7050 aluminum alloy during hot deformation LI Jun-peng(李俊鹏), SHEN Jian(沈 健), YAN Xiao-dong( 闫晓东), MAO Bai-ping(毛柏平), YAN Liang-ming( 闫亮明) General Research Institute for Non-Ferrous Metals, Beijing 100088, China Received 4 December 2008; accepted 27 March 2009 Abstract: Hot compression of 7050 aluminum alloy was performed on Gleeble 1500D thermo-mechanical simulator at 350 ℃ and 450 ℃ with a constant strain rate of 0.1 s−1 to different nominal strains of 0.1, 0.3 and 0.7. Microstructures of 7050 alloy under various compression conditions were observed by TEM to investigate the microstructure evolution process of the alloy deformed at various temperatures. The microstructure evolves from dislocation tangles to cell structure and subgrain structure when being deformed at 350 ℃, of which dynamic recovery is the softening mechanism. However, continuous dynamic recrystallization (DRX) occurs during hot deformation at 450 ℃, in which the main nucleation mechanisms of DRX are subgrain growth and subgrain coalescence rather than particle-simulated nucleation (PSN). Key words: microstructure evolution; dynamic recovery; dynamic recrystallization; hot deformation; 7050 alloy process during high temperature deformation [6−8]. In 1 Introduction this work, microstructure of 7050 alloy deformed to different strains at different temperatures under constant The softening (restoration) processes of recovery strain rate were