IPC技术标准目录之 电 子 组 装(Assembly).docVIP

IPC技术标准目录之 电 子 组 装（Assembly） 2004-01-01 ?? IPC.org ?? ?? 点击: 5523 IPC技术标准目录之 电 子 组 装（Assembly） IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 IPC-TM-650 Test Methods Manual试验方法手册 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) IPC/EIA J-STD-001C Requirements for Soldered Electrical Electronic Assemblies电气与电子组装件锡焊要求 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 SMC-WP-003 Chip Mounting Technology 芯片贴装技术 J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注：IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory) IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封