非接触集成电路卡的模型分析和的研究.pdfVIP

巾文抽要 中文摘要 入珲解，结合电磁场珲论，对非接触E作了详细的分析。采用ISO／IECl0373专用测 试仪，通过对已有的非接触}进行测试，完成了耦合系数k的测试与标定以及非接触 卡的等效负载的测试与标定，实现了非接触夤的模型和读写器激励源的模型，并给 出了相应的测试方法。最后，结合实际的电路设计参数，通过hspise仿真，验证采 用此方法建立的非接触卡的等效模型是正确的． 本论文给出了一套建立非接触卡模型的方法，可供非接触f：的设计及非接触卡 读写器的设计作为参考． ＼ 关键词：非接触卡，非接触读写器，非接触卡等效阻抗，耦合系数。负载调制 涎丈摘罂 Abstract With oftheinternationalstandard thoroughlyunderstanding ISO／IEC 14443and 10373 ISO／IEC which the characteristicsandthe specifiedphysical testmethodsofcontaetlesssmart withthe of card．combiningtheory electromagneticfield，thisarticle the of presentedworkingprinclple contactlesssmartcardwhosecarrier is13．56Mhz．Some frequency essential parameters，suchasthe coefficientKandthe load coupling equivalent contactlesscardweremeasured resistor＆of a usingspecialtesting instrument．Themethodswerealsoavailableinthearticle．Asa testing modelofcontactlesssmartcardandthe result，theequivalent interrogator was accomplished，whichwasverifiedthesimalationof software． by Hspice Thearticle aseriesofmethods thecontactlesssmart proposed modeling card， whichcan thedes ofthe smart contactlesscardandthe help ign