《BGA Package Underfilm for》.pdfVIP

BGA Package Underfilm for Autoplacement Jan Danvir Tom Klosowiak NIST-ATP Acknowledgment Project Brief Microelectronics Manufacturing Infrastructure (October 1998) Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach Develop new materials and technology needed to allow existing integrated-circuit fabrication facilities using conventional surface mount technology to handle new direct chip attach components, enabling more efficient production of these high-performance devices. Sponsor: Motorola, Inc. 1301 East Algonquin Road Schaumburg, IL 60196 •Project Performance Period: 4/9/1999 - 10/8/2003 Principal Investigator Janice Danvir Active Project Participants o Auburn University (Auburn, AL) o Loctite Corporation (Rocky Hill, CT) ATP Project Manager Francis Barros, (301) 975-2617 francis.barros@ Inserted from /atpcf/prjbriefs/prjbrief.cfm?ProjectNumber=98-06-0008 The Development / Transfer Process Motorola Labs •Gap Assessment Tech Business •Validation •Benchmarking Transfer •Ramp to Production •Technology Development BGA/CSP Package Risk • Flip Chip Primary concern is CTE mismatch  Mitigate difference between silicon and laminate Thermal cycling  Full, void-free coverage • Packages Primary concerns are drop and bend  Mechanical Reinforcement  Full coverage not required The Manufacturability Issues •Capillary dispense underfill is a difficult process for an SMT factory Extra Equipment / Floor Space Cycle Time Material Storage Material Handling Clean-up Rework Underfill Alternatives •No underfill still preferred Design solu