半导体封装制程与设备材料知识介绍资料.ppt

* pad lead pad lead pad lead pad lead pad lead Disconnection of the tail pad lead Disconnection of the tail pad lead Formation of a new free air ball 焊线(Wire Bond) 2.Wire Bond 相关材料 Leadfram Capillary Gold Wire Leadfram Capillary Capillary Manufacturer (SPT, GAISER, PECO, TOTO…) Capillary Data ( Tip , Hole , CD , FAOR , IC ) TIP ..…… Pad Pitch Pad pitch x 1.3 = TIP Hole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = H CD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball size FA OR….Pad pitch(um) F