聚酰亚胺无机填料导热复合材料的制备与性能研究本科生毕业设计（论文）.docVIP

河 北 工 业 大 学 毕 业 论 文 作 者： 张亚哲 学 号： 110936 学 院： 化工学院 系(专业)： 高分子材料与工程 题 目： 聚酰亚胺/无机填料导热复合材料的制备与性能研究 指导者： 瞿雄伟 教授 评阅者： 副教授 2015年6月5日 毕业设计(论文)中文摘要 题 目：聚酰亚胺/无机填料导热复合材料的制备与性能研究 摘要： 聚酰亚胺是一种耐热性十分良好的功能高分子材料，还具有良好的机械性能、性等，受到了广泛关注。氮化硼是一种应用广泛的陶瓷材料，具有高导热率、电绝缘性优良，能够在提高聚合物导热率的同时保持材料的电绝缘性。 本课题以聚酰亚胺(PI)为聚合物基体，以氮化硼(BN)为无机填料，制备了PI/BN复合薄膜，并使用硅烷偶联剂KH-560对BN进行表面修饰。通过多种测试方法分析了BN表面改性效果和填料含量对复合材料导热性能、耐热性能、力学性能和电绝缘性等的影响。结果表明，PI基体中，BN的质量分数越高，复合材料的导热性提高越多；KH-560成功接枝到了BN表面，导热效果较原始BN有所提高。随着导热的提高，PI/BN材料的电绝缘性能够得到良好保持但当BN含量较高时其力学性能会受到影响，因此，BN的用量应根据实际需求综合考虑。 关键词：聚酰亚胺 复合薄膜 氮化硼 热导率 导热机理 毕业设计(论文)外文摘要 Title Preparation and of polyimide/inorganic filler thermally conductive composites Abstract Polyimide is well known as functional polymer materials with heat resistance, mechanical properties and low dielectric. Boron nitride (BN) is a kind of ceramic filler, which is widely used in science and technology, displaying very high thermal conductivity while keeping electrically insulation. Besides, BN could also remain dielectric when the thermal conductivity is high. For PI/BN composites, the surface of BN were tried to make KH-560 graft chemically to improve the compatibility between the matrix and the filler, which can reduce the heat transfer resistance between them. The surface treatment and the effects of fillers content on the thermal conductivity, electric insulation performance, mechanical properties and thermal stability of the composites were discussed in detail by many modern characterizing methods. KH-560 has been successfully grafted to the surface of BN particles. With a rise in the BN contents, the thermal conductivity of the PI/BN composites increased. As a result, the thermal conductivity of modified PI/BN composites is higher than that of PI/original BN. With the increase of BN content, the composites could remain good electrical insulation while the tensile strength sho