本科毕业设计论文bcb图形化工艺研究.docVIP

BCB微图形化工艺研究 摘要 微细加工技术是人类迄今为止所能达到的精度最高的加工技术，其加工尺寸已经达到深亚微米、百纳米、甚至纳米级，在当今技术领域已经具有举足轻重的地位。本文所讲就是微加工一种工艺的实验研究。它是利用化学聚合物作为牺牲层，本文主要描述利用旋涂和加热固化的方法形成厚度在几微米的薄膜，此薄膜可以用光刻及法刻蚀的方法图形化及去除。具体操作步骤为：先在硅片上均匀涂敷一层，其进行自升温固化或进行快速热处理，然后再在膜上均匀涂敷一层光刻胶，通过前烘、曝光、显影等工艺，再法刻蚀在硅片上形成图形。本文主要目的是通过大量实验，制备不同的，得到这些不同的成膜条件、图形化。 关键词：微加工光刻刻蚀 Study on BCB’s figure treatment technology Abstract The submicro processing technology is one of the precist manufacture technology that could be achieved today. The resulting size has reached to the micron more inferior deeply and hundred nanometer and even to the extent that the nanometer level now, it plays an important role in today’s technology field. What this text speaks is the experiment research which is one kind of method of submicro processing. It uses chemical polymer based on BCB –--- dry-etch CYCLOTENE advanced electronics resins as a sacrifice to go on figure treatment. This paper is chiefly described to the BCB and is used to spread soon and heats that the method solidifying forms thickness several microns to the film of tens microns, and this film can be used photolithograph and wet etching that the method graphization losing reaches to go to remove. The concrete operating sequence is: Coat one even layer of adhesion on the silicon chip first , and then a BCB membrane storey, and then carries on his certainly liter temperature solidification or carries on quick heat treatment, then coat a layer of photoresist evenly on BCB membrane, go on baking , exposing , developing etc. and then using dry-etch process to form BCB figure.The main purpose of this paper is to prepare BCB membrane of different thickness through a large number of experiments , to get the membrane condition , figure treatment　condition of these different BCBs. Keyword: BCB ; Submicro processing ;Photolithograph ;Etching 目录 1绪论 1 1.1概述 1 1.2 BCB概况及应用 2 1.3本课题的来源及背景 2 1.4本课题的主要任务和内容安排 3 2 BCB介绍 4 2.1概述 4 2.2 BCB的性能 4 2.3 BCB的热处理 4 2.4 BCB的应用方法 5 3 光刻的基本理论 6 3.1概述 6 3.2光刻胶 7 3.3光刻基本工艺