集成电路标准封装_new资料.docVIP

? AC97v2.2 specification ? AGP 3.3VAccelerated Graphics PortSpecification 2.0 ? AGP PROAccelerated Graphics Port PROSpecification 1.01 ? AGPAccelerated Graphics PortSpecification 2.0 ? AMRAudio/Modem Riser ? BGABall Grid Array ? BQFP132 ? EBGA 680L ? ? LBGA 160L ? ? PBGA 217LPlastic Ball Grid Array ? SBGA 192L ? ? TSBGA 680L ? ? C-Bend Lead ? CERQUADCeramic Quad Flat Pack ? CLCC ? ? CNRCommunication and Networking Riser Specification Revision 1.2 ? CPGACeramic Pin Grid Array ? Ceramic Case ? LAMINATE CSP 112LChip Scale Package ? DIPD