ic封装形式文稿.docVIP

各种IC封装形式图片 BGABall Grid Array EBGA 680L LBGA 160L PBGA 217LPlastic Ball Grid Array  SBGA 192L TSBGA 680L CLCC CNRCommunication and Networking Riser Specification Revision 1.2  CPGACeramic Pin Grid Array DIPDual Inline Package  DIP-tabDual Inline Package with Metal Heatsink FBGA FDIP FTO220 Flat Pack HSOP28 ITO220 ITO3p JLCC LCC LDCC LGA LQFP PCDIP PGAPlastic Pin Grid Array PLCC详细规格 PQFP PSDIP LQFP 100L详细规格 METAL QUAD 100L详细规格 PQFP 100L详细规格 QFPQuad Flat Package SOT220 SOT223 SOT223 SOT23 SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343 SOT523 SOT89 SOT89 Socket