氩气氛围中6061-15%(wt)SiCp的瞬时液相扩散连接——外文翻译解说.doc

Transient liquid phase diffusion bonding of 6061-15wt% SiCp in argon environment J. Maitya,?, T.K. Pal b, R. Maitic a Department of Metallurgical and Materials Engineering, National Institute of Technology, Durgapur, Durgapur 713209, West Bengal, India b Welding Technology Center, Department of Metallurgical and Material Engineering, Jadavpur University, Kolkata 700032, West Bengal, India c Central Research Facility, Indian Institute of Technology, Kharagpur 721302, West Bengal, India Abstract Extruded 6061-15wt% SiCp composite was joined by transient liquid phase diffusion (TLPD) bonding process in argon environment using 50-_mthick copper foil interlayer. The bonding was carried out at 560 ?C with two different applied pressures (0.1 and 0.2MPa) and five different holding times (20 min, 1, 2, 3 and 6 h). Kinetics of the bonding process was significantly accelerated in the presence of reinforcement (SiC). This acceleration is attributed to the increased solute diffusivity through defect-rich SiC particle/matrix interface and porosity. Adequate bond strength (90% of the original composite strength)was achieved for bonding at 0.2MPa pressure with 6h of holding. This is very close to the reported highest bond strength achieved (92% of the original composite strength) for joining aluminium-based metal matrix composite by TLPD process in vacuum followed by isostatic pressing. The rejection of oxide at periphery on completion of isothermal solidification, and elimination of void at bond interface through solid state diffusion at higher pressure (0.2MPa) were the main reasons of achieving high bond strength. Keywords: Transient liquid phase diffusion;Bonding;6061-SiCp composite; Particle segregation; Isothermal solidification; Oxidation ;Bond strength 氩气氛围中6061-15%（wt）SiCp的瞬时液相扩散连接J.Maitya,*，T.K.Palb,R.Maitic a 印度，西孟加拉邦，杜尔加布尔713209研究所，冶金与材料工程技术系； b印度，西孟加拉邦，加尔各答700032研究所，贾普达大学，冶金与材料工程系，焊接技术中心； c 印度，西孟加拉邦，克勒格布尔721302研究所，印度理工学院，核心研究机构； 摘要： 在氩气氛围中通过液相扩散连接项目，用50um厚的铜箔层挤压6061-1