SMT表面基准.ppt

SMT表面贴装检验基准 IC Solder (SMD) Acceptable: 1. Minimum side joint length (D) is equal to lead width (W); 2. Minimum heel fillet height (F) is equal to solder thickness (G) plus 50% lead thickness (T) at connection side. Chip Component Placement (SMD) Acceptable: Side overhang (A) is less than or equal to 50% width of component termination area (W) or 50% width of land (P) Chip Component Placement (SMD) Acceptable: Side overhang (A) is less than or equal to 25% of component diameter (W), or land width (P), whichever is less. Chip Component Placement (SMD) Acceptable: Chip component side way or flip over Reject: Tombstone Chip Component Solder (SMD) Acceptable: Excess solder is not touching body Chip Component Solder (SMD) Acceptable: End solder joint width ? is minimum 50% component diameter (W) or land width (P), whichever is less IC Placement (SMD) Acceptable: Overhang (A) is less than or equal to 50% lead width (W) or 0.5 mm, whichever is less. IC Solder (SMD) Acceptable: 1. Minimum side joint length (D) is equal to lead width (W); 2. Minimum heel fillet height (F) is equal to solder thickness (G) plus 50% lead thickness (T) at connection side. Soldering Defect (SMD) Excessive solder touch component body Solder bridge Soldering Defect (SMD) Incomplete solder reflow of solder paste or disturbed solder Dewetting Solder Ball Acceptable: Entrapped Touching (short) two leads Chip Component Damage (SMD) 标准： 锡膏回流焊后完全将焊端与焊盘熔接在一起， 且表面锡点光亮。 限度接受标准： 锡膏回流焊后完全将焊端和焊盘熔接在一起， 但焊点表面有显微镜观察仍有颗粒状突起。 拒绝接受标准： ①锡膏回流焊后，锡膏仍未完全熔化； 锡膏熔化后焊端与焊盘未完全熔接； ②锡膏在回流焊后，焊端或焊盘不吃焊锡形成 假焊。 假焊NG 103 103 103 标准： 元件回流焊接后，其焊点表面光亮无突出物出现 且基板表面无任何锡珠、锡渣以及各焊端间无焊 锡相连等现象。 103 103 103 ≤0.13mm 不超过元件表面 ≤1.0mm 限度接受标准：①在600mm2范围内直径小于 0.13mm锡珠不能超过5个； ②锡尖突出部分（锡尖类）竖直方向未超过元件 平面，水平方向未超过1.0mm情况下可以接受。 拒绝接受标准：①直径超过0.13mm锡珠、锡珠 均不能接受； ②锡尖突出部分（锡尖类）竖直方向超过元件 平面，水平方向超过1.0mm情况下不可以接受。 ③不相连的两点或焊端有焊锡相连不可接受。 103 103 103 锡 桥 标准： 元件焊脚上锡高度h要大于元件高度H的1/3而小 于元件高度H 。 1/3 H