FLUENT培训教材06传热模型介绍.pptVIP

输出– ANSYS 通过 GUI 或 TUI输出ANSYS 文件 /file/export/ansys file-name 文件包括坐标、连接关系及下面 的标量： Density, viscosity X, Y, Z velocity, pressure, temperature Turbulence kinetic energy, turbulence dissipation rate, turbulent viscosity, effective viscosity Thermal conductivity (laminar, turbulent, effective) Total pressure and temperature, pressure coefficient, Mach number, stream function, heat flux, heat transfer coefficient, wall shear stress, specific heat 输出 – ABAQUS 输出文件（ file.aba）包括坐标、连接关系、选择的载荷、域组、速度、选择的标量等 只对三维模型有效，并且是固体域或固体域的表面 流体域的传热系数不可写出 下面命令对做流固交界面分析有用 file/export/abaqus file-name list-of-surfaces () yes|no list-of-scalars q 输出其他格式 NASTRAN/PATRAN 对于 ABAQUS, NASTRAN, 和 PATRAN, 选择要写出的载荷 (Force, Temperature, and/or Heat Flux) 来分析结构应力 (fluid pressure or thermal) 如果没有选择面的话，载荷只在边界面上写出 Format Supported Version Abaqus 6.3 ANSYS 10 ASCII n/ CGNS 2 NASTRAN 2001 PATRAN 2001 TECPLOT 9 报告 – Heat Flux Heat flux 报告: 建议检查热平衡以确 保计算收敛 输出 Heat Flux 数据: 可以输出壁面的热通量数据 （包括辐射） file/export/custom-heat-flux 文件格式: zone-name nfaces x_f y_f z_f A Q T_w T_c HTC … 报告 – 传热系数 基于壁面函数的传热系数 其中 cP 为比热, kP 是点P处湍动能, T* 无量纲温度: 只有湍流并且能量方程开关打开时有用 谢谢 A Pera Global Company ? PERA China The definition of E is E= h – pv + V^2/2 But pressure work and kinetic energy are not included by default for incompressible flows using segregated solver. * As an example illustrating FLUENT’s capability to handle conjugate heat transfer problems, flow over an electronic chip mounted on a circuit board is presented. Here, the small box represents the chip, which contains a total energy source of 2 watts. The air heats as it flows over the chip, causing the chip to cool simulatneously. Heat transfer mechanisms considered in this simulation are: Heat conduction inside the chip Conduction from the chip to the wall Conduction along the length of the board Convection from the chip and board to the flowing air. The upper wall as well as the bottom surface of the c