IC工艺_0_2讲述.pptVIP

微电子工业的未来 21世纪前20年，以PC 的需求驱动集成电路发展 21世纪后20年，除PC会继续发挥影响外，与internet相结合的，可移动的，网络化的，智能化的，多媒体的 实时信息设备和系统将是主要驱动力 计算机，通信和消费电子产品的一体化也将是重要的驱动力。 * * 21世纪的微电子技术将从目前的3G时代逐步发展到3T时代，即存储量有Gb发展到Tb，集成电路中器件的速度由GHz发展到THz,数据传输速率由Gbps发展到Tbps. 通过将微电子集成技术与其它学科相结合，成功典型：微电子机械系统(MEMS)，微电光机械系统(MOEMS)以及生物芯片(bio-chip) * * * 31 Praxair Semiconductor Manufacturing Technology, Module 3: Semiconductor Manufacturing Processes Die Cut and Assembly After electrical test, the wafer is scored with a special diamond saw and broken into individual die. The marked (non-functional) die are discarded and functional die are passed on into the wire bonding process. * 32 Praxair Semiconductor Manufacturing Technology, Module 3: Semiconductor Manufacturing Processes Die Attach and Wire Bonding Once separated into individual die, the functional devices are attached to a lead frame assembly. A drop of precisely engineered compound is placed beneath the die to glue it to the lead frame assembly and provide good electrical grounding and heat transfer for the silicon device. Aluminum or gold leads are attached via thermal compression or ultrasonic welding. The automated process attaches the ultra-thin wires (about 30 μm in diameter, 1/3 the diameter of a human hair) between each device bonding pad and a connector of the lead frame. There are thousands of different packages available, each specially engineered to provide a specific benefit such as small package size, high frequency information transmission or protection from extreme environmental conditions such as heat, cold or moisture. 1 * * 33 Praxair Semiconductor Manufacturing Technology, Module 3: Semiconductor Manufacturing Processes Final Test After wire bonding is completed, the packaging is completed by molding the device into a plastic enclosure. Packages are precisely engineered to provide good thermal conductivity, easy assembly into printed circuit boards and protection from damaging environmental conditions. These packages are often tested ag