SMT检验标准(PCBA).docVIP

检验项目:A-1零件脚吃锡不足 SOP QFP (Inspection Item: A-1 Insufficient Solder SOP QFP Lead) 允收标准(Accept Standard) 吃锡应该达零件脚长的1/2以上及需有 爬锡的状況 Side joint length (D) is more than 50% of lead length(L). 拒收标准(Reject Standard) 吃锡未达脚长1/2以上 Side joint length (D) is less than 50% of lead length(L) . 检验项目：A-2零件脚吃锡不足 PLCC SOJ (Inspection Item: A-2 Insufficient Solder PLCC SOJ Lead) 允收标准(Accept Standard) 吃锡高度(F)＞＝零件脚厚度(T) 的1/2 ＋焊接物(G) Heel fillet height(F) more than solder thickness(G) plus 50% Lead thickness(T) 拒收标准(Reject Standard) 吃锡高度(F)零件脚厚度(T)的1/2 +焊接物(G) Heel fillet height(F)less than solder thickness(G) + 50% lead thickness(T) 检验项目:A-3零件偏移SOP QFP (Inspection Item:A-3 Component Shift SOP QFP ) 允收标准(Accept Standard) 偏移: 1.零件脚(W)超出PCB不可超过本体宽度的1/4 Component lead shift off the pad,ut not exceed 1/4 width of lead width (W) 2.对于尺寸小于0.5mm之QFP零件偏移量不可超过本体宽度的1/2. The QFP component lead of pitch less than 0.5mm shift off the pad, but not exceed 1/2 width of lead width . 拒收标准(Reject Standard) 1.零件偏离焊垫且零件与焊垫接触面积(C) 占零件本体宽度(W)的3/4以下. Component lead shift off the pad andcontact the pad less than3/4 width of lead width(W) 检验项目:A-4零件偏移 PLCC SOJ (Inspection Item: A-4 Component Shift) 允收标准(Accept Standard) 零件脚超出PCB(A)不可超过本体1/4(W) Component Lead shift off the pad, but not exceed 1/4 width of Lead area(W). 拒收标准(Reject Standard) 零件偏离焊垫且超出本体面积1/4(W). Component Lead shift off the pad and exceed 1/4 width of Lead area(W) 检验项目:A-5 零件偏移 (Inspection Item:A-5 Component shift) 允收标准(Accept Standard) 零件位於焊垫中心点. Component is on the center of pad 拒收标准(Reject Standard) 零件偏离焊垫且超出本体宽度1/4. Component body shift off the pad and exceed 1/4Width of body width. 检验项目: A-6吃锡过多 (Inspection Item:A-6 Excess Solder) 允收標準(Accept Standard) 吃锡带形状如锥形. The con