ChemicalMechanicalPolishing(CMP)Overview[化学机械研磨(CMP)](-54)报告范本.ppt

Outline CMP Basics CMP Process Optimization Environmental Issues in CMP CMP Basics (cont’d) How does CMP work? A rotating wafer is pressed face-down against a rotating polishing pad; an aqueous suspension of abrasive (slurry) is pressed against the face of the wafer by the pad. A combination of chemical and physical effects removes features from the wafer surface. CMP Apparatus Metal Damascene Process Trenches/vias etched into ILD (interlayer dielectric) Metal deposition Metal CMP Repeat for multiple levels of metal Brush Box Double Side Scrubbing (DSS)System Configuration