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毕业论文设计--智能电脑散热系统设计报告
目录
1、前言··································································1
2、总体方案设计 ·························································2
2.1设计内容··························································2
2.2方案比较··························································2
2.3方案论证··························································3
2.4方案选择··························································3
3、单元模块电路简介与设计················································4
3.1本系统部分器件介绍················································4
3.1.1 DS18B20 温度传感器简介··········································4
3.1.2 STC89C52RC 单片机简介···········································4
3.1.3 ULN2003 芯片简介···············································5
3.2单元模块电路设计··················································6
3.2.1 电源电路·····················································6
3.2.2 单片机主芯片电路··············································7
3.2.3 时钟电路·····················································7
3.2.4 复位电路·····················································8
3.2.5显示电路······················································8
3.2.6温度检测电路··················································9
3.2.7 按键控制电路··················································9
3.2.8 报警及电机电路················································9
3.3模块连接总电路···················································10
4、软件设计·····························································11
4.1程序设计原理及所用工具········································11
4.2主程序设计····················································11
4.3主要模块主程序设计············································12
5、系统调试·····························································15
6、系统功能、指标参数···················································18
7、结论·································································19
8、总结与体会···························································20
9、参考文献······························································21
附录1:ISIS仿真图、PCB板图、实物图
附录2:程序源
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