磁性微型压力感测器之设计.doc

磁微型壓力感測器of Magnetic Micro-Pressure Sensor 研究生： Chieh-Ting Li 指導教授：陳永昌 Yung-Chang Cheng Microelectroforming 方式，搭配高深寬比之黃光製程、精密體型微細加工技術與微磁性合金電鑄技術，最後應用於微型壓力感測器中。本研究利用創新之微磁性合金電鑄技術與低阻率之銅電鑄線圈，設計出高精度與動態量測之微型壓力感測器。合金磁性薄膜微電鑄製程，乃將鐵鎳 Fe/Ni 磁性合金材料分別以磁性合金電鑄方式，設計出高靈敏度之磁性薄膜。磁性薄膜完成後，配合厚膜光阻AZ-4620及精密銅電鑄，設計出高導電率之銅感應線圈，最後配合體型微細加工技術，以緩衝氧化蝕刻液 Buffered Oxide Etching，BOE 蝕刻出較適合之壓力腔，便可得到其磁性微型壓力之感測元件。最後實驗結果得知關鍵字：This study adopts Microelectroforming of magnetic alloy membrane, and matches with lithography fabrication process of high depth-width ratio, Micromachining Technology and Micro-magnetic Alloy Electroforming to apply on micro-pressure sensor. With the innovative Micro-magnetic Alloy Microelectroforming and low resistance of copper electroform coil, this study has designed a high accuracy and dynamic measurement of micro-pressure sensor. The manufacturing process of Microelectroforming of magnetic alloy membrane is to manufacture the FE/Ni magnetic alloy to high sensitive magnetic membrane by Magnetic Alloy Electroforming. Then it matches with Thick Film Photo-resist AZ-4620 and Micro-copper Electroforming, and high conductivity copper induction coil is designed. Finally, with the Bulk Micromachining Technology , the Buffered Oxide Etching BOE is used to etch suitable pressure cavity. Then the magnetic micro-pressure sensor can be obtained. The experimental result shows that the when the temperature of plating solution is 50℃, current density is 5ASD and period is one hour, the etched electric membrane is relatively stable. For the magnetic membrane pressure sensor, the minimum and maximum displacement is 0.03539mm and 0.03826mm respectively. Keywords: Magnetic film ,micro-pressure sensor, electroforming, Fe/Ni Alloy