MMX-888规格英文版.docVIP

Multi-Point Compensating X-Ray Drilling Machine Model　 ＭＭＸ－８８８ SPECIFICATION MURAKI LTD. SEIKO PRECISION INC. SPECIFICATION FOR MMX-888 (Multi-Point Compensating X-Ray 2 Spindle Automatic Measuring and Drilling Machine for Multi-Layer Boards) Outline This is a drilling machine that measures the coordinates of more than 2 guide-mark positions, and compensates the difference between the designed mark positions and the actual mark positions in X and Y direction to drill holes at the points which have the minimum difference from the designed position. Equipped with 2 units of X-ray drilling portion, the machine is capable of high-speed and precise processing by drilling 2 holes simultaneously. The processed boards can be either taken out from the operator side manually or be discharged automatically toward the backside of the machine. When connecting to a shearing machine, boards can be discharged to a receiver of the shearing machine. Main specification 1) PCB work piece Work piece material: Copper-clad laminate Size: Min. 290 × 310 mm Max. 610 × 710 mm (refer to the Drawing No.3) Thickness: 0.3 – 6.0 mm *Depends on material and warp of PCB, thickness of copper foil, drill shape, drilling condition, etc. Edge of PCB:Horizontal Max. 25mm Vertical;Downward; 0 mm Upward; 8 mm (refer to the Drawing No.1) Warp of PCB: Max. 10 mm (refer to the Drawing No.2) 図１ Warp of PCB 図２ Size of PCB 図３ 2) Image processing unit (1) X-ray camera: II-camera (2) Monitor: 12.4 inch monitor and touch panel TFT module. (3) Target Mark: as arrangement (4) Image processing method: Center of gravity method Image processing area: Max. 10 × 10 mm 3) Drilling function Spindle power: Air (Standard) Spindle rotation: 30,000 rpm (without load) Drilling stroke: 8 mm (from table surface) Diameter of collect chuck: φ3.175 mm(1/8〞) Drilling capacity: Max. φ6 mm Drilling position: X-axis 300 – 700 mm (refer to Drawing No.) Y-axis 0 – 600