日本东京精密.docVIP

东京精密株式会社 公司简介 东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三鹰市, 在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等. 　　We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems. Our philosophy is to generate long-term growth through the creation of WIN-WIN, or mutually beneficial, relationships, with all our stakeholders - customers, business partners, shareholders and employees.（公司网站原文） 东京精密主要从事半导体加工设备及精密测量仪器制造及开发. 半导体加工设备有硅片加工用地倒角机、内圆切片机, 半导体加工前道工序用的光刻机（LEEPL）、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、硅片背面抛光机等. 　　过去，东京精密简称“TSK”，在国内半导体行业享有盛誉。现在东京精密采用了新的商标“ACCRETECH”，她是由英文成长ACCRETE和技术TECHNOLOGY的合成词，是融合公司”以WIN-WIN精神工作，创世界一流产品“经营理念的新标志。 　　参展产品：硅片材料的内圆切片机、硅片倒角机，光刻机，CMP，硅片表面检查系统，探针台背面减薄抛光机，划片机。 　　网址： http://www.accretech.jp/ Semiconductor Manufacturing Equipment:Product list Wafer Manufacturing System Variety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Grinding Machine. Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300 Feature 1 Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette. Wafer Edge Grinding: W-GM-5200 Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possible. Low damage grinding method is available. Feature 1 Machine specification ready for 300 mm and 200 mm wafer. Feature 2 Visual system (optional) for measuring the chamfer width of periphery and notch. Wafer Edge Grinding: W-GM-4200 Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed waf